Cooling device for an electronic component heat sink



FIG. 1 is a front, bottom, left-side perspective view of a cooling device for an electronic component heat sink showing our new design, the front, top, left-side being a mirror image thereof;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a right-side elevational view thereof;

FIG. 5 is a left-side elevational view thereof;

FIG. 6 is an enlarged view of an area shown in a dashed line box labeled “6” in FIG. 2; and,

FIG. 7 is an enlarged view of an area shown in a dashed line box labeled “7” in FIG. 3.

The dashed line boxes identify areas that are enlarged, and form no part of the claimed design. 

CLAIM The ornamental design for a cooling device for an electronic component heat sink, as shown and described. 